RGP15A thru rgp15m vishay semiconductors formerly general semiconductor document number 88701 www.vishay.com 08-feb-02 1 glass passivated junction fast switching rectifier reverse voltage 50 to 1000v forward current 1.5a patented* maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. rgp rgp rgp rgp rgp rgp rgp parameter symbol 15a 15b 15d 15g 15j 15k 15m unit maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current 0.375" (9.5mm) lead length at t a =55? i f(av) 1.5 a peak forward surge current 8.3ms single half sine-wave superimposed i fsm 50 a on rated load (jedec method) maximum full load reverse current, full cycle average 0.375" (9.5mm) lead length at t a =55? i r(av) 100 a typical thermal resistance (1) r ja 45 ?/w operating junction and storage temperature range t j , t stg -65 to +175 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. maximum instantaneous forward voltage at 1.5a v f 1.3 v maximum dc reverse current t a =25? 5.0 at rated dc blocking voltage t a =150? i r 200 a maximum reverse recovery time i f =0.5a, i r =1.0a, i rr =0.25a t rr 150 250 500 ns typical junction capacitance at 4.0v, 1mhz c j 25 pf notes: (1) thermal resistance from junction to ambient at 0.375 (9.5mm) lead length, p.c.b. mounted do-204ac (do-15) features ?plastic package has underwriters laboratories flammability classification 94v-0 ?high temperature metallurgically bonded construction ?cavity-free glass passivated junction ?capable of meeting environmental standards of mil-s-19500 ?1.5 ampere operation at t a =55? with no thermal runaway ?typical i r less than 0.1 a ?high temperature soldering guaranteed: 350?/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-204ac, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.015 oz., 0.4 g 0.034 (0.86) 0.028 (0.71) dia. 0.140 (3.6) 0.104 (2.6) dia. 0.230 (5.8) 0.300 (7.6) 1.0 (25.4) min. 1.0 (25.4) min. dimensions in inches and (millimeters) * glass-plastic encapsulation technique is covered by patent no. 3,996,602 and brazed-lead assembly by patent no. 3,930,306
RGP15A thru rgp15m vishay semiconductors formerly general semiconductor www.vishay.com document number 88701 2 08-feb-02 25 50 75 100 125 150 175 0 0.25 0.5 0.75 1.0 1.25 1.5 1 10 100 0 10 20 30 40 50 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 1 10 100 1 10 100 0 20 40 60 80 100 0.01 0.1 1 10 20 0.01 0.1 1 10 100 0.1 1 10 100 fig. 1 - forward current derating curve fig. 4 - typical reverse characteristics fig. 5 - typical junction capactitance fig. 6 - typical transient thermal impedance fig. 2 - maximum non-repetitive peak forward surge current fig. 3 - typical instantaneous forward characteristics ambient temperature ( c) instantaneous forward voltage (v) reverse voltage (v) average forward rectified current (a) peak forward surge current (a) instantaneous reverse leakage current ( a) transient thermal impedance ( c/w) instantaneous forward current (a) juncton capacitance (pf) 0.375" (9.5mm) lead length resistive or inductive load t j = t j max 8.3ms single half sine-wave (jedec method) number of cycles at 60 hz percent of rated peak reverse voltage (%) t, pulse duration (sec.) t j = 25 c pulse width = 300 s 1% duty cycle t j = 125 c t j = 75 c t j = 25 c t j = 25 c f = 1.0 mhz vsig = 50mvp-p ratings and characteristic curves (t a = 25 c unless otherwise noted)
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